Case study: Precise laser production for printed circuit boards

The customer, a leading expert in the application of innovative laser technologies for the processing of rigid and flexible printed circuit boards (PCBs), uses state-of-the-art processes to ensure precise and efficient manufacturing processes. The core tasks include the residue-free and high-precision depanelling of PCBs, which enables maximum material savings and a low reject rate thanks to a dense component arrangement and placement. Laser drilling of microstructures as small as 2µm in diameter also places high demands on precision and process control. Ultra-short pulse lasers (USP) are used here, which process micro-materials without melting and without reworking. Other laser applications include creating predetermined breaking points, milling cavities for microchip placement and laser trimming, such as cutting photovoltaic panels to size.

A key challenge is to develop a technical solution that ensures reliable 24/7 operation of the machines. At the same time, it is necessary to integrate a motherboard with seven PCIe slots into the Industrial PC that will be available for at least five years.